Fab tools are being fine-tuned for TSV processes as demand ramps for everything from HBM to integrated RF, power, and MEMS in ...

Source Heterogeneous SoCs for AI: The PULP Platform Experience” was published by researchers at University of Bologna.

The U.S. Department of Energy will contribute $179 million for three new Microelectronics Science Research Centers, which will focus on research into solutions that bridge sensing, edge processing, AI ...

In 2024, hot topics included challenges involving chiplets and heterogeneous integration, AI, data management, MCUs, power semis, software-defined vehicles, sensors, adaptive test, yield tracking, ...

Deep UV microLED for maskless lithography; avalanching nanoparticles for optical computing; Probabilistic computing with stochastic spintronics.

A new technical paper titled “Multifunctional 2D FETs exploiting incipient ferroelectricity in freestanding SrTiO 3 nanomembranes at sub-ambient temperatures” was published by researchers at Penn ...

Experts at the Table: The automotive ecosystem is in the midst of an intense evolution as OEMs and tiered providers grapple with how to deal with legacy technology while incorporating ever-increasing ...

A new technical paper titled “Memory-Centric Computing: Recent Advances in Processing-in-DRAM” was published by researchers at ETH Zurich. “Memory-centric computing aims to enable computation ...