See MCM and known-good software. THIS DEFINITION IS FOR PERSONAL USE ONLY. All other reproduction requires permission.

The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...

Smiths Interconnect has introduced a production probe head for wafer-level packages and known good die. Part of its Volta range Volta 180 is a WLCSP test connector for chips with 180um pitch IO. The ...