With the investment made at that time, LG Innotek acquired the Gumi Plant 4, which has a total floor area of 230,000 square meters, and established the "Dream Factory," which serves as a production ...

LG Innotek CEO Mun Hyuk-soo launches mass production of FC-BGA substrates for PCs We have started mass production of high-value semiconductor substrates, such as flip-chip (FC)-ball grid arrays ...

The pads are, in turn, connected to the package through a solder ball in much the same way that a ball grid array (BGA) package is connected to a printed circuit board (PCB). (See Figure B) The main ...

A common packaging type, like the Ball Grid Array (BGA), encapsulates the die with molding compound and uses wire bonds to connect the die to a substrate, enabling integration with PCBs. In devices ...

a ball grid array (BGA), a type of surface mount packaging for electronic components; and a tamper mechanism. Watermarking and using “various cryptographic operations using cipher algorithms such as ...

Accordingly, this study aims to investigate the microstructure and mechanical properties of Sn-58Bi solder bearing micro-sized Zn-particles and prepare the ball grid array (BGA) solder joints using ...