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WEBWASHINGTON – Global semiconductor industry sales hit $51.3 billion in July, an increase of 18.7% compared to the July 2023 total of $43.2 bi... BANGKOK – Cal-Comp Electronics reported sales of $975.1 million for the second quarter, a decrease of 10.6% from the same quarter last year.... ROSHEIM, FRANCE – French electronics manufacturer ...
IFC Considers $150M Investment in Salcomp India Expansion
WEBApr 5, 2024 · Salcomp Tech would use the funds to expand its manufacturing capacity in Chennai. The total project cost is $250 million and IFC is providing a seven-year loan up to $150 million to fund the project. Salcomp Tech is 100% owned by Salcomp Plc, a Finland-based holding company. Salcomp Plc is a wholly …
Circuits Assembly Online Magazine - 2022 Magazine Archives
WEBSeptember 2022. Why I4.0 and reshoring go hand in hand. A no-flux reflow process for vacuum soldering. Ensuring proper alignment of layers and components on a PCB. The SMTAI Womenâ s Leadership Program. Lean manufacturing and program management.
WEBThis amount was applied in the tin/lead experiment. For a no-clean, alcohol flux of 1.5 percent solids, the amount to apply on the test board is: Area board = 100 * 160 mm2 = 24.8 in2. Amount of (wet) flux per board = solid content flux * area * required amount dry flux = 100/1.5 * 24.8 * 0.0016 = 2.645 g.
Tackling Head-in-Pillow Defects with Vapor Phase Reflow - Circuits …
WEBHead-in-pillow (HiP) defects are one of the most common issues that affect printed circuit boards containing ball grid array/land grid array (BGA/LGA) packages. These defects can result in costly repairs and reduce a component’s lifespan. HiP defects are compromised solder joints often attributed to undesired environmental factors during the reflow process.
Sn-Bi Low-Temperature Homogeneous Solder Joint Microstructure ...
WEBJan 21, 2020 · How do LTS solders perform under thermal cycling and drop-shock testing? Several environmental, technology and reliability factors have recently combined to renew interest in the use of tin-bismuth-based solder alloys for motherboard manufacturing.
Yes, J-STD-001 and IPC-A-610 Can Be Used Together - Circuits …
WEBMay 8, 2019 · Using the two documents together can be rewarding, but to do so successfully requires knowledge and vigilance. As an aside, IPC will host a pair of technical education courses, Process and Acceptability Requirements: Utilizing J-STD-001 and IPC-A-610 Together, on Sept. 10 in Huntsville, AL, and on Dec. 3 in Anaheim, CA.
Locating BGA Joint Failures - Circuits Assembly
WEBFeb 26, 2020 · This month we show examples of testing BGAs with a “dye and pry,” a simple and cost-effective way of looking at joint failure or their condition after some form of mechanical testing or abnormal assembly practice. FIGURE 1 shows a sample BGA joint after dye-and-pry testing. Eighty percent of the separated surface is covered by the red dye.
Circuits Assembly Online Magazine - Microcircuit Aging/Wearout …
WEBMar 12, 2019 · Sherlock contributes to publication of SAE ARP6338A Beltsville, MD – March 12, 2019 – DfR Solutions played an integral role in the recent publication of the SAE International Revision A of Aerospace Recommended Practice 6338: “Process for Assessment and Mitigation of Early Wearout of Life-limited Microcircuits.”
ASMPT Collaborates with IBM Research on AI Chip Tech
WEBHONG KONG – ASMPT will provide integrated solutions for heterogeneous integration, including ALSI laser saw/grooving and interconnect tools, in support of IBM artificial intelligence research. “The future of AI computing performance depends on the development of hardware that meets the fast-growing demands of emerging AI …
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